caddock electronics, incorporated 1717 chicago aven u e riversi d e , californi a 92507-2 3 6 4 phon e: (909) 788-1700 ? fax: (909) 369-1151 caddock electronics europe bv jupiterstraat 2, postbus 3018 6460 ha kerkrade, the netherlands phon e : (31) 4 5 5 46365 0 ? fa x : (31) 4 5 5 4628 6 0 ? 1999 caddock electronics, inc. c a d k doc il-103.0 3 9 t o-126 and t o-220 style power packages - non-inductive designs mp808 / mp825 (to-126 style) and mp816 / mp850 (to-220 style) kool-pak ? power film resistors use your thermal design experience with power semiconductors in the to-220 and to-126 style power package. this experience will help you get the most out of this unique family of power resistors. the thermal design issues are the same where power handling capability is based on the case temperature which is maintained in your design. page 1 of 2 construction of mp808 and mp816: mp 816 koo l - pak ? power resistors to-220 style power package mp808 and mp816 with a n all molded package configuration mp 808 koo l - pak ? power resistors to -126 style power package 8 watts at +25 c case temperature derated to zero at +150 c thermally conductive molded package lower cost resistance range of 0.020 ohm to 10.0k resistor element is electrically isolated from the mounting surface 16 watts at +25 c case temperature derated to zero at +150 c thermally conductive molded package lower cost resistance range of 0.10 ohm to 10.0k resistor element is electrically isolated from the mounting surface the mp808 and mp816 kool-pak ? power film resistors are constructed with caddock's micronox ? resistance film fired onto a flat ceramic substrate. the terminal attachment and resistance element geometry are configured to provide outstanding non-inductive performance. the resistor body is completely surrounded by a high thermal conductivity molding compound to finish this cost effective power resistor package. 8 w atts 16 w atts mp 825 koo l - pak ? power resistors to-126 style power package the mp825 and mp850 kool-pak ? power film resistors are constructed with caddock's micronox ? resistance film fired onto a flat ceramic substrate. the terminal attachment and resistance element geometry are configured to provide outstanding non-inductive performance. the ceramic substrate is bonded to a copper heat sink which becomes the metal mounting surface. this assembly is molded in a high thermal conductivity molding compound with the copper heat sink flush with the back surface of the part. mp825 and mp850 power packages include an integral metal mounting surface for highly efficient thermal t ransfer mp 850 koo l - pak ? power resistors to-220 style power package construction of mp825 and mp850: 25 watts at +25 c case temperature derated to zero at +150 c copper heat sink integral in the molded package resistance range of 0.020 ohm to 10.0k resistor element is electrically isolated from the mounting surface 25 w atts 50 w atts 50 watts at +25 c case temperature derated to zero at +150 c copper heat sink integral in the molded package resistance range of 0.20 ohm to 10.0k resistor element is electrically isolated from the mounting surface
caddock electronics, incorporated 1717 chicago avenue riverside, california 92507-2364 phone: (909) 788-1700 ? fax: (909) 369-1151 caddock electronics europe bv jupiterstraat 2, postbus 3018 6460 ha kerkrade, the netherlands phone: (31) 45 5 463650 ? fax: (31) 45 5 462860 ? 1999 caddock electronics, inc. cad k doc il-103.019 typical temperature coefficient curve (5 w and above) * 25 100 150 case temperature, c 0 20 40 100 rated load, % 80 60 o derating curve temperature coefficient: tc referenced to +25 c, d r taken at +150 c 5.00 ohms and above, -20 to +50 ppm/ c 0.50 ohm to 4.99 ohms, -20 to +80 ppm/ c 0.050 ohm to 0.49 ohm, 0 to +200 ppm/ c 0.020 ohm to 0.049 ohm, 0 to +300 ppm/ c the case temperature is to be used for purposes of establishing the maximum applied power. see derating curve. the case temperature measurement is made with the thermocouple contacting the bottom insulated mounting surface of the package (center of bottom surface), the device mounted on a heat sink, thermal grease applied at a mounting torque of up to 8 in-lbs (0.90 n-m) maximum. without a heat sink, when in free air at +25 c, the mp808 and the mp825 are rated for 1.25 watts, the mp816 and the mp850 are rated for 2.25 watts. derating ( thermal resistance ) for each model is as follows: mp808: 0.064 w/ c ( 15.63 c/w ) mp816: 0.128 w/ c ( 7.81 c/w ) mp825: 0.200 w/ c ( 5.00 c/w ) mp850: 0.400 w/ c ( 2.50 c/w ) mounting note: the mp kool-pak ? resistors must be mounted using a screw and compression washer mounting technique. this will provide sufficient pressure on the package over time and through large temperature variations to maintain the maximum power dissipation capability. mounting torque to avoid package damage is 8 in-lbs (0.90 n-m). 1 0 1 % r 55 25 100 150 case temperature, c o d integral metal mounting surface in molded package 0.20 w 10.0 k 300 1,500 figure 2 to-220 style 50 watts * mp 850 integral metal mounting surface in molded package 0.020 w 10.0 k 300 1,500 figure 1 to-126 style 25 watts * mp 825 model no. power rating dielect. strength v rms ac min. max. terminal resistance max. voltage package dimensions comments * mp 808 8 watts 1,500 0.020 w 10.0 k solderable 300 to-126 style figure 1 all molded package 0.10 w 10.0 k 300 1,500 figure 2 to-220 style 16 watts * mp 816 all molded package solderable solderable solderable mp816 - 50.0 - 1% model number: resistor value: tolerance ordering information : dimensions in inches and (millimeters) .640 .010 (16.26 .26) .030 .004 (.76 .10) .025 .004 (.64 .10) .200 .010 (5.08 .26) .500 .050 (12.70 1.27) .130 .030 (3.30 .76) .125 .010 (3.18 .26) .410 .010 (10.41 .26) mp 850 10.0 1% .125 .010 (3.18 .26) .125 .004 (3.18 .10) dia. c l .053 .007 (1.35 .18) .070 .010 (1.78 .26) + .030 .004 (.76 .10) .023 .004 (.58 .10) .200 .010 (5.08 .26) .450 .050 (11.43 1.27) .115 .010 (2.92 .26) mp 808 0.10 1% .110 .010 (2.79 .26) .053 .007 (1.35 .18) .058 .007 (1.47 .18) .320 .010 (8.12 .26) .094 .004 (2.39 .10) dia. c l .440 .010 (11.18 .26) .080 .020 (2.03 .51) figure 1 to-126 style mp808, mp825 figure 2 to-220 style mp816, mp850 specifications: resistancetolerance: 1% for 0.050 w up to10.0k w , 5% for 0.020 w up to 0.049 w (0.5%, 2%,5%,10% and 20% are available for most resistance values). insulation resistance: 10,000 megohms, min. the resistor element is electrically isolated from the mounting surface . terminal strength: mil-std-202, method 211, cond. a (pull test) 5 lbs. mp808, mp816, mp825: d r (0.2 percent + 0.001 ohm) max. mp850: d r (0.2 percent + 0.01 ohm) max. thermal shock: mil-std-202, method 107, cond. f. mp808, mp816, mp825: d r (0.3 percent + 0.001 ohm) max. mp850: d r (0.3 percent + 0.01 ohm) max. momentary overload: mp816 and mp850: 2 times rated power with applied voltage not to exceed 1.5 times maximum continuous operating voltage for 5 seconds. mp816: d r (0.3 percent + 0.001 ohm) max. mp850: d r (0.3 percent + 0.01 ohm) max. mp808 and mp825: 1.5 times rated power with applied voltage not to exceed 1.5 times maximum continuous operating voltage for 5 seconds. mp808, mp825: d r (0.3 percent + 0.001 ohm) max. moisture resistance: mil-std-202, method 106. mp808, mp816, mp825: d r (0.5 percent + 0.001 ohm) max. mp850: d r (0.5 percent + 0.01 ohm) max. load life: 2,000 hours at rated power. power rating dependent upon case temperature. see derating curve. mp808, mp816, mp825: d r (1.0 percent + 0.001 ohm) max. mp850: d r (1.0 percent + 0.01 ohm) max. shock: 100g, mil-std-202, method 213, cond. i . mp808, mp816, mp825: d r (0.2 percent + 0.001 ohm) max. mp850: d r (0.2 percent + 0.01 ohm) max. vibration, high frequency: mil-std-202, method 204, cond. d. mp808, mp816, mp825: d r (0.2 percent + 0.001 ohm) max. mp850: d r (0.2 percent + 0.01 ohm) max. measurement note: for these specifications, resistance measurement shall be made at a point 0.2 inch (5.08 mm) from the resistor body. mp808 / mp825 (to-126 style) and mp816 / mp850 (to-220 style) kool-pak ? power film resistors page 2 of 2
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